Ni/Cu electroplating, a worthwhile alternative to use instead of Ag screen-printed front side metallization of conventional solar cells
Identifieur interne : 000105 ( Main/Exploration ); précédent : 000104; suivant : 000106Ni/Cu electroplating, a worthwhile alternative to use instead of Ag screen-printed front side metallization of conventional solar cells
Auteurs : A. Bouyelfane [Algérie] ; A. Zerga [Algérie]Source :
- Materials science in semiconductor processing [ 1369-8001 ] ; 2014.
Descripteurs français
- Pascal (Inist)
- Dépôt électrolytique, Sérigraphie, Métallisation, Cellule solaire, Fabrication industrielle, Rendement élevé, Diminution coût, Traitement matériau, Effet photovoltaïque, Evaluation performance, Ombrage, Résistance contact, Cellule solaire silicium, Dépôt par oxydoréduction, Barrière diffusion, Diffusion(transport), Optimisation, Réponse spectrale, Paramètre cristallin, Résistivité couche, Programme simulation, Nickel, Cuivre, Argent, Matériau cristallin, Polycristal, Fabrication microélectronique, 8540L, 8460J, 6630P, 66, 8540H.
- Wicri :
- topic : Fabrication industrielle, Nickel, Cuivre, Argent.
English descriptors
- KwdEn :
- Contact resistance, Copper, Cost lowering, Crystalline material, Diffusion, Diffusion barriers, Electrodeposition, Electroless deposition, High efficiency, Lattice parameters, Manufacturing, Material processing, Metallizing, Microelectronic fabrication, Nickel, Optimization, Performance evaluation, Photovoltaic effects, Polycrystals, Screen printing, Shading, Sheet resistivity, Silicon solar cells, Silver, Simulation program, Solar cells, Spectral response.
Abstract
For commercial purposes, it is necessary to manufacture high-efficiency and low-cost solar cells using simple processes. The front contact formation is one of the most critical steps in solar cell processing. Although silver paste screen-printed solar cells are the most widespread on the photovoltaic market, their efficiency is strongly limited as a result of shading and resistive losses, or more precisely the high contact resistance. Cu metallization for crystalline Si solar cells has attracted much attention as an alternative to the screen-printing technology. The low-cost Ni/Cu metal contact is regarded as the next generation of metallization processes to still improve the efficiency with a low specific contact resistance; it is formed using low-cost electroless plating and electroplating. A diffusion barrier should be placed between Cu and Si, to prevent Cu diffusion. Ni is shown to be an adequate barrier to Cu diffusion. For these reasons, geometry optimization of metal contacts of the front face, deposited by commercial processes, is investigated in this paper, in order to improve the spectral response of conventional multicrystalline mc-Si silicon solar cells. Their efficiency variation is analyzed as a function of changes in cell parameters (finger separation distance, height and width of finger, sheet resistance emitter...) using simulation programs in MATLAB, using contours to represent the efficiency evolution in terms of two variables. Efficiency gain of more than 0.7% has been achieved in this study. The simulation results were then compared with experimental data in order to be validated.
Affiliations:
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Zerga</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Third-generation Solar Cells, Research Unit of Materials and Renewable Energies (URMER), Abou BakrBelkaïd University, B.P. 119</s1><s2>Tlemcen</s2><s3>DZA</s3><sZ>1 aut.</sZ><sZ>2 aut.</sZ></inist:fA14><country>Algérie</country><wicri:noRegion>Tlemcen</wicri:noRegion></affiliation></author></titleStmt><publicationStmt><idno type="wicri:source">INIST</idno><idno type="inist">14-0266258</idno><date when="2014">2014</date><idno type="stanalyst">PASCAL 14-0266258 INIST</idno><idno type="RBID">Pascal:14-0266258</idno><idno type="wicri:Area/PascalFrancis/Corpus">000009</idno><idno type="wicri:Area/PascalFrancis/Curation">000432</idno><idno type="wicri:Area/PascalFrancis/Checkpoint">000019</idno><idno type="wicri:explorRef" wicri:stream="PascalFrancis" wicri:step="Checkpoint">000019</idno><idno type="wicri:doubleKey">1369-8001:2014:Bouyelfane A:ni:cu:electroplating</idno><idno type="wicri:Area/Main/Merge">000106</idno><idno type="wicri:Area/Main/Curation">000105</idno><idno type="wicri:Area/Main/Exploration">000105</idno></publicationStmt><sourceDesc><biblStruct><analytic><title xml:lang="en" level="a">Ni/Cu electroplating, a worthwhile alternative to use instead of Ag screen-printed front side metallization of conventional solar cells</title><author><name sortKey="Bouyelfane, A" sort="Bouyelfane, A" uniqKey="Bouyelfane A" first="A." last="Bouyelfane">A. Bouyelfane</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Third-generation Solar Cells, Research Unit of Materials and Renewable Energies (URMER), Abou BakrBelkaïd University, B.P. 119</s1><s2>Tlemcen</s2><s3>DZA</s3><sZ>1 aut.</sZ><sZ>2 aut.</sZ></inist:fA14><country>Algérie</country><wicri:noRegion>Tlemcen</wicri:noRegion></affiliation></author><author><name sortKey="Zerga, A" sort="Zerga, A" uniqKey="Zerga A" first="A." last="Zerga">A. Zerga</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Third-generation Solar Cells, Research Unit of Materials and Renewable Energies (URMER), Abou BakrBelkaïd University, B.P. 119</s1><s2>Tlemcen</s2><s3>DZA</s3><sZ>1 aut.</sZ><sZ>2 aut.</sZ></inist:fA14><country>Algérie</country><wicri:noRegion>Tlemcen</wicri:noRegion></affiliation></author></analytic><series><title level="j" type="main">Materials science in semiconductor processing</title><title level="j" type="abbreviated">Mater. sci. semicond. process.</title><idno type="ISSN">1369-8001</idno><imprint><date when="2014">2014</date></imprint></series></biblStruct></sourceDesc><seriesStmt><title level="j" type="main">Materials science in semiconductor processing</title><title level="j" type="abbreviated">Mater. sci. semicond. process.</title><idno type="ISSN">1369-8001</idno></seriesStmt></fileDesc><profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Contact resistance</term><term>Copper</term><term>Cost lowering</term><term>Crystalline material</term><term>Diffusion</term><term>Diffusion barriers</term><term>Electrodeposition</term><term>Electroless deposition</term><term>High efficiency</term><term>Lattice parameters</term><term>Manufacturing</term><term>Material processing</term><term>Metallizing</term><term>Microelectronic fabrication</term><term>Nickel</term><term>Optimization</term><term>Performance evaluation</term><term>Photovoltaic effects</term><term>Polycrystals</term><term>Screen printing</term><term>Shading</term><term>Sheet resistivity</term><term>Silicon solar cells</term><term>Silver</term><term>Simulation program</term><term>Solar cells</term><term>Spectral response</term></keywords><keywords scheme="Pascal" xml:lang="fr"><term>Dépôt électrolytique</term><term>Sérigraphie</term><term>Métallisation</term><term>Cellule solaire</term><term>Fabrication industrielle</term><term>Rendement élevé</term><term>Diminution coût</term><term>Traitement matériau</term><term>Effet photovoltaïque</term><term>Evaluation performance</term><term>Ombrage</term><term>Résistance contact</term><term>Cellule solaire silicium</term><term>Dépôt par oxydoréduction</term><term>Barrière diffusion</term><term>Diffusion(transport)</term><term>Optimisation</term><term>Réponse spectrale</term><term>Paramètre cristallin</term><term>Résistivité couche</term><term>Programme simulation</term><term>Nickel</term><term>Cuivre</term><term>Argent</term><term>Matériau cristallin</term><term>Polycristal</term><term>Fabrication microélectronique</term><term>8540L</term><term>8460J</term><term>6630P</term><term>66</term><term>8540H</term></keywords><keywords scheme="Wicri" type="topic" xml:lang="fr"><term>Fabrication industrielle</term><term>Nickel</term><term>Cuivre</term><term>Argent</term></keywords></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="en">For commercial purposes, it is necessary to manufacture high-efficiency and low-cost solar cells using simple processes. The front contact formation is one of the most critical steps in solar cell processing. Although silver paste screen-printed solar cells are the most widespread on the photovoltaic market, their efficiency is strongly limited as a result of shading and resistive losses, or more precisely the high contact resistance. Cu metallization for crystalline Si solar cells has attracted much attention as an alternative to the screen-printing technology. The low-cost Ni/Cu metal contact is regarded as the next generation of metallization processes to still improve the efficiency with a low specific contact resistance; it is formed using low-cost electroless plating and electroplating. A diffusion barrier should be placed between Cu and Si, to prevent Cu diffusion. Ni is shown to be an adequate barrier to Cu diffusion. For these reasons, geometry optimization of metal contacts of the front face, deposited by commercial processes, is investigated in this paper, in order to improve the spectral response of conventional multicrystalline mc-Si silicon solar cells. Their efficiency variation is analyzed as a function of changes in cell parameters (finger separation distance, height and width of finger, sheet resistance emitter...) using simulation programs in MATLAB, using contours to represent the efficiency evolution in terms of two variables. Efficiency gain of more than 0.7% has been achieved in this study. The simulation results were then compared with experimental data in order to be validated.</div></front></TEI><affiliations><list><country><li>Algérie</li></country></list><tree><country name="Algérie"><noRegion><name sortKey="Bouyelfane, A" sort="Bouyelfane, A" uniqKey="Bouyelfane A" first="A." last="Bouyelfane">A. Bouyelfane</name></noRegion><name sortKey="Zerga, A" sort="Zerga, A" uniqKey="Zerga A" first="A." last="Zerga">A. Zerga</name></country></tree></affiliations></record>Pour manipuler ce document sous Unix (Dilib)
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